Journal of Chemistry and Chemical Research

This paper focuses on optimizing plasma processing techniques for low-dielectric-constant packaging materials. It elucidates the critical role of plasma treatment in enhancing material performance, with detailed analysis of process parameters such as gas selection, power regulation, and time control that influence dielectric properties, surface characteristics, and mechanical properties. Through in-depth research and practical exploration, this study proposes effective strategies to optimize plasma processing techniques. These strategies aim to significantly improve the performance of low-dielectric-constant packaging materials, meet the growing performance demands in the electronic packaging industry, and drive technological advancement.

Low-dielectric-constant materials; Plasma processing; Process parameters; Material performance; Electronic packaging