车规级芯片“零缺陷”质量管理体系构建研究

Research on the construction of a 'zero defect' quality management system for automotive-grade chips

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DOI 10.12208/j.jer.20250260
刊名
Journal of Engineering Research
年,卷(期) 2025, 4(6)
作者
作者单位

美光半导体(西安)有限责任公司 陕西西安

摘要
在汽车智能化、电动化快速发展背景下,车规级芯片作为汽车电子系统核心,其质量直接关乎行车安全与产业竞争力。面对芯片生产工艺复杂、失效模式多样、环境适应性要求高等质量管控难题,构建“零缺陷”质量管理体系成为必然选择。围绕芯片全生命周期,从设计开发、生产制造、供应链协同、质量检测等环节入手,搭建“零缺陷”质量管理体系框架,明确各环节核心管控要点与技术手段,并提出组织、技术、文化等多维度实施保障策略。体系各环节协同优化,形成质量改进闭环,为车规级芯片产业质量提升提供理论与实践支撑。
Abstract
In the context of the rapid advancement of automotive intelligence and electrification, automotive-grade chips, as the core of automotive electronic systems, directly impact driving safety and industrial competitiveness. Given the challenges of complex chip manufacturing processes, diverse failure modes, and stringent environmental adaptability requirements, establishing a 'zero defect' quality management system is essential. This study focuses on the entire lifecycle of chips, starting from design and development, production, supply chain coordination, and quality testing. It outlines the framework of a 'zero defect' quality management system, clarifies key control points and technical methods at each stage, and proposes implementation strategies from organizational, technical, and cultural perspectives. The coordinated optimization of all system components forms a closed loop for quality improvement, providing theoretical and practical support for enhancing the quality of the automotive-grade chip industry.
关键词
车规级芯片;零缺陷;质量管理体系;全生命周期;质量管控
KeyWord
Automotive-grade chips; Zero defect; Quality management system; Full lifecycle; Quality control
基金项目
页码 42-44
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刘娟. 车规级芯片“零缺陷”质量管理体系构建研究 [J]. 工程学研究. 2025; 4; (6). 42 - 44.

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