Journal of Electrical Engineering and Automation

Advanced packaging technology plays a crucial role in enhancing the performance and integration level of electronic devices, but its widespread adoption faces multiple technical bottlenecks. Insufficient material compatibility affects long-term stability, while increasing manufacturing process complexity restricts mass production efficiency. The lack of an effective design coordination mechanism and the inadequacy of testing and reliability evaluation systems further hinder development. Through material innovation, process optimization, and the application of intelligent inspection methods, these challenges are being gradually addressed. In the future, advanced packaging will evolve toward high-density interconnection, three-dimensional heterogeneous integration, and smart manufacturing, expanding its application prospects in fields such as high-performance computing, artificial intelligence, and communications.

Integrated circuit; Advanced packaging; Technological innovation; Chip performance; Manufacturing challenges