Journal of Electrical Engineering and Automation

Advanced packaging technology plays an increasingly important role in integrated circuit manufacturing, especially in breaking through the limitations of Moore's Law. By analyzing key technical paths such as infrared and visible light image fusion, fusion algorithms in defect recognition, and multi-source image collaborative detection, this study reveals the current development status and core challenges of these technologies. Research indicates that deep learning, multi-modal data fusion, and efficient algorithm design are crucial for improving detection accuracy and system intelligence. Overall, related technologies are evolving toward high integration, low latency, and strong generalization capabilities, providing solid support for multiple high-tech fields.

Power transmission and transformation equipment; Infrared image; Visible light image; Image fusion; Defect detection