Journal of Electrical Engineering and Automation

With the development of miniaturization and functional integration of electronic devices, edge computing has become an important part of the modern computing system. HDI (High-Density Interconnector) circuit boards play a crucial role in meeting the requirements of edge computing systems for high-performance and high-density circuits. Focusing on the signal integrity issues of 12-layer HDI circuit boards for edge computing, this paper mainly discusses the noise interference, attenuation during signal transmission, and optimization methods for impedance matching. By establishing a circuit board model and conducting simulation analysis, a series of strategies to solve signal integrity problems are proposed, including selecting appropriate materials, optimizing layout design, and adjusting impedance control methods. Reasonable design and optimization can effectively improve the quality of signal transmission, providing an important reference for the development of high-performance edge computing devices.

Edge computing; HDI circuit board; Signal integrity; Impedance matching; Simulation analysis