International Journal of Mechanical Engineering

The development and development of printed board is inseparable from the rapid development of devices. Because the developed printed board must meet the electrical assembly technical requirements of the device, so that the functional parameters of the device can play a full role, to ensure the high stability and high reliability of the operation pan of the electronic equipment. In particular, the progress of surface packaging (SMT) and microassembly (CSP or CMT) devices puts forward higher technical requirements for the manufacturing process of the printed plate. To this end, the printed board manufacturing process. Must adapt to the needs of the rapidly developing microelectronics technology. Therefore, studying the process characteristics of the device is an important way to develop a novel screen structure. Therefore, based on the characteristics of device process, how to improve the manufacturing process of printed circuit board.

device process; manufacturing level; PCB; improve