International Journal of Mechanical Engineering

The wafer manufacturing process is complex, and controlling key parameters directly impacts product quality. Statistical Process Control (SPC) enables real-time monitoring and analysis of these parameters. This paper focuses on key parameters such as photoresist film thickness, line width after lithography and development, and overlay accuracy. By using SPC control charts to track trends and assessing process capability indices, the paper formulates strategies for parameter optimization, anomaly handling, and continuous improvement. Production validation has shown that the improved control strategy significantly enhances parameter stability, effectively improves product quality and production efficiency, and strengthens the company's competitiveness.

Wafer manufacturing; Statistical Process Control (SPC); Key parameters; Control strategy; Process capability index