International Journal of Mechanical Engineering

Micron-level precision platforms for chip packaging are prone to interference from multi-source vibrations during operation, which affects positioning accuracy and production stability. This study focuses on active vibration suppression, constructing a high-sensitivity detection model and a multi-channel real-time feedback control system to achieve rapid sensing and active compensation of micron-level displacement disturbances. By using high-bandwidth sensors and adaptive control algorithms, vibrations in different frequency bands are suppressed in a hierarchical manner. The effectiveness is verified through finite element simulations and experimental tests. The results show that this technology can significantly improve the accuracy and stability of chip packaging operations, providing an important reference for the design optimization of high-precision packaging equipment and the development of vibration control technologies in micro-nano manufacturing.

Chip packaging; Micron-level precision platform; Active vibration suppression; Adaptive control; Accuracy improvement