Journal of Engineering Research

The explosive growth in demand for artificial intelligence computing power has driven advanced semiconductor packaging technology to become a core track in industrial development. As a core 2.5D advanced packaging solution developed by Intel, Embedded Multi-die Interconnect Bridge (EMIB) technology has emerged as an important technical path for heterogeneous integration, leveraging advantages in cost, yield, and design flexibility. This paper systematically elaborates on the core principles and process characteristics of EMIB packaging, comparatively analyzes its core advantages over traditional packaging technologies, clarifies its mainstream application scenarios, examines the current challenges in technological development, and sorts out the future direction of technological evolution. Meanwhile, combined with the industrial development trends, providing a reference for industrial research and investment decision-making in the semiconductor advanced packaging industry.

EMIB packaging; Advanced packaging; 2.5D packaging; Heterogeneous integration; Semiconductor industry