International Journal of Materials Science

Since e-cigarettes have been popularized around the world, national and local governments tend to encourage e-cigarette development, so the technical requirements such as e-cigarette routing and battery power supply are also higher. However, with the continuous expansion of the number and market scale of domestic e-cigarette products in recent years, the cost of e-cigarette manufacturing will gradually rise. In order to alleviate this problem, the production of economic and environmentally friendly electronic fog core has become an inevitable trend. In this context, how to achieve low-cost, high-performance e-cigarette products are more competitive will become a big challenge for e-cigarette factories. At present, there are many common semiconductor packaging technologies on the market, such as hot plug and packaging metallization, but limited by the manufacturing process capacity and packaging cost, they cannot meet the differentiated needs of customers for different sizes of packaging products. To enable e-cigarettes to achieve a smaller chip size with high reliability and high performance requirements.

e-cigarette chip; packaging technology; COB