磁性剪切增稠抛光力理论与实验研究

Theoretical and experimental investigation on magnetorheological shear thickening polishing force using multi-pole coupling magnetic field

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DOI https://doi.org/10.1016/j.jmatprotec.2024.118414
刊名
年,卷(期) 2024, 328()
作者
作者单位 山东理工大学

摘要
磁性剪切增稠抛光技术凭借其剪切增稠和磁化增强的双重刺激响应特性,已成为一种极具前景的磁场辅助抛光技术。然而,在现有的抛光力理论和实验研究中,主要考虑的是磁化增强现象,而剪切增稠效应尚未被纳入其中。此外,对于考虑力特性变化的抛光机制的系统性研究也较少。本研究旨在填补这些研究空白,通过建立正常力和切向力的理论模型,并揭示磁流变剪切增稠抛光过程中的微观抛光机制。通过考虑抛光介质在磁场下的流变特性以及塑性压痕理论,建立了正常力和切向力的抛光力模型。在多极耦合磁场下进行了抛光力测量实验,以揭示抛光力随不同抛光参数的变化情况,并验证所建立的模型。此外,将抛光介质成分的微观结构演变和抛光后的表面形态与深入分析相结合,以明抛光机制。经过抛光处理后,表面质量显著提高,且无可见划痕。在3.36牛顿的法向力和2.42牛顿的切向力作用下,从初始值245纳米的表面粗糙度达到了 48纳米。该研究深入揭示了抛光力的特性及抛光机制,为优化抛光参数和提高抛光质量提供了理论指导。
Abstract
The magnetorheological shear thickening polishing method, with its dual-stimulus response of shear thickening and magnetization enhancement, has emerged as a promising magnetic field-assisted polishing technology. However, in existing theories and experimental studies on polishing forces, the phenomenon of magnetization enhancement was mainly considered. The shear thickening effect has not yet to be incorporated into. Further more, there have been few systematic investigations on the polishing mechanism considering variations of force characteristics. The study aims to fill in these research gaps by developing theoretical models for both normal and tangential forces, and revealing the microscopic polishing mechanism during the magnetorheological shear thickening polishing process. Both normal and tangential polishing force models were established through taking the rheological properties of polishing media under magnetic field and plastic indentation theory into account. Polishing force measurement experiments under a multi-pole coupling magnetic field were conducted to reveal the variations of the polishing forces with different polishing parameters and to validate the established models. Furthermore, the microstructural evolutions of the polishing media components and the surface morphologies after polishing were combined with in-depth analysis to elucidate the polishing mechanism. The polished surface quality was significantly improved without visible scratches. The surface roughness of 48 nm was achieved from the initial value of 245 nm under the normal force of 3.36 N and the tangential force of 2.42 N. The study provides deep insights into the polishing forces characteristics and the polishing mechanism, which contributes to a theoretical guidance for optimizing polishing parameters and improving polishing quality.
关键词
磁性剪切增稠抛光 抛光力 表面演化机制 表面粗糙度
KeyWord
Magnetorheological shear thickening polishing Polishing force Microstructural evolution mechanism Surface roughness
基金项目
页码 118414-
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Cheng Qian, Yebing Tian, Shadab Ahmad, Zhen Ma, Ling Li, Zenghua Fan.. 磁性剪切增稠抛光力理论与实验研究 [J]. Journal of Materials Processing Technology. 2024; 328; (). 118414 - .

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